Sputtering implies the deposition of a metal on a surface by using fast ions to eject particles of it from a target. Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a “target” that is a source onto a “substrate” such as a silicon wafer. Sputtering is used in the manufacture of efficient solar cells.
Talk to Us
Contact Muthu 7358263274